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Undergraduate Education

Microelectronic Technology and Packaging

Code: 3.5.3400.7 | 7th Semester | Obligatory by selection | Flow H | ECTS: 3

Lecture Hours - Lab Hours: 2 - 1

Description

Vacuum technologies: mechanical pumps, high vacuum pumps, ultrahigh vacuum pumps. Crystal development: molten Si crystal development, moving zone technology, GaAs crystal development, characterization of materials, epitaxial growth, structure and defects of epitaxial growth systems. Thin film development: thermal oxidation, chemical vapor deposition of dielectric materials, chemical vapor deposition of poly-Si, atomic layer deposition, thermal evaporation, electron beam evaporation, sputtering. Lithography: optic lithography, wet lithography, dry lithography, new generation of lithography techniques. Semiconductor doping: basics of diffusion, diffusion process, ion implantation, structural disorder due to implantation and thermal annealing. Development of integrated circuits and devices: passive elements, bipolar technology, MOS FET technology, nanoelectronics. Packaging: Cross talk and technology to reduce it, wafer slicing, wire bonding, polymeric packaging, electronic material & device packaging, thick and hybrid film technology. Laboratory: vacuum pump operation, thin film development and characterization, simulation of microelectronic structures.

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