Electronic Packaging Techniques

Code 3.5.3322.9
Semester 9th
Flow H - Electronics, Circuits, Materials
Category Obligatory by selection
Credits 4
Class Hours - Lab Hours 2 - 2
Lecturers Evangelos Hristoforou
Links Helios, Course's Website
Web Platform Class 1: Microsoft Teams


It introduces the Electronic and Computer engineer to the principles of electronic packaging that are used today in a wide spectrum of applications. The use of the PCB, Thick film and thin film technologies in the field of Multi-Chip Modules fabrication is explained during this course. The main interconnection problems a designer is faced today in high bit rate systems (i.e. crosstalk, ringing, etc) are discussed and the students have the opportunity to study them in the Laboratory.