Electronic Packaging Techniques
|Flow||H - Electronics, Circuits, Materials|
|Category||Obligatory by selection|
|Class Hours - Lab Hours||2 - 2|
|Links||Helios, Course's Website|
It introduces the Electronic and Computer engineer to the principles of electronic packaging that are used today in a wide spectrum of applications. The use of the PCB, Thick film and thin film technologies in the field of Multi-Chip Modules fabrication is explained during this course. The main interconnection problems a designer is faced today in high bit rate systems (i.e. crosstalk, ringing, etc) are discussed and the students have the opportunity to study them in the Laboratory.