Microelectronic technology and packaging


Code 3.5.3400.7
Semester 7th
Flow H - Electronics, Circuits, Materials
Category Obligatory by selection
Credits 3
Class Hours - Lab Hours 2 - 1
Lecturers Evangelos Hristoforou

Description

Vacuum technologies: mechanical pumps, high vacuum pumps, ultrahigh vacuum pumps. Crystal development: molten Si crystal development, moving zone technology, GaAs crystal development, characterization of materials, epitaxial growth, structure and defects of epitaxial growth systems. Thin film development: thermal oxidation, chemical vapor deposition of dielectric materials, chemical vapor deposition of poly-Si, atomic layer deposition, thermal evaporation, electron beam evaporation, sputtering. Lithography: optic lithography, wet lithography, dry lithography, new generation of lithography techniques. Semiconductor doping: basics of diffusion, diffusion process, ion implantation, structural disorder due to implantation and thermal annealing. Development of integrated circuits and devices: passive elements, bipolar technology, MOS FET technology, nanoelectronics. Packaging: Cross talk and technology to reduce it, wafer slicing, wire bonding, polymeric packaging, electronic material & device packaging, thick and hybrid film technology.

Laboratory: vacuum pump operation, thin film development and characterization, simulation of microelectronic structures.